Kontron COMe-bIP6 Manual do Utilizador Página 125
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COMe-bIP6 / BIOS Operation
Memory Configuration
Feature Options Description
DIMM Profile
Default DIMM profile
Custom Profile
XMP profile 1
XMP Profile 2
Select DIMM timing profile that should be used
Memory Frequency
Auto
1067
1333
1600
Maximum Memory Frequency Selections in MHz
Max TOLUD
Dynamic
1 GB … 3.25GB
Maximum Value of TOLUD. Dynamic assignment would
adjust TOLUD automatically based on largest MMIO
length of installed graphic controller. Manual TOLUD
setting from 1GB to 3.25GB in 0.25GB steps
MRC FastBoot Disabled
Enabled
Enable/Disable MRC FastBoot
Memory Remap Disabled
Enabled
Enable/Disable Memory Remap above 4GB
Memory Alias Check Enabled
Disabled
Enable/Disable Memory Alias Check
125
- COMe-bIP6 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- 2.5 COM Express® Benefits 9
- 3 Product Specification 10
- 3.2 Functional Specification 12
- PCH comparison 15
- Graphics Core 16
- Connectivity 18
- Misc Interfaces and Features 19
- Kontron Features 19
- Additional features 19
- Power Features 19
- 3.3 Block Diagram COMe-bIP6 20
- Intel® 3rd Generation Core 21
- Connector AB – pin-out T6 21
- Intel® 7-Series PCH 21
- Connector CD – pin-out T6 21
- 3.5 Accessories 22
- 3.6 Electrical Specification 23
- 3.6.5 ATX Mode 24
- 3.6.6 Single Supply Mode 24
- 3.7 Power Control 25
- 3.8.2 Humidity 26
- WEEE Directive 27
- Conformal Coating 27
- Shock & Vibration 28
- 3.10 MTBF 29
- 3.11 Mechanical Specification 30
- 3.12 Module Dimensions 31
- 3.14 Onboard Fan Connector 33
- 4 Features and Interfaces 34
- 4.2 Rapid Shutdown 35
- 4.5 SPI boot 38
- Using an external SPI flash 39
- 4.6 M.A.R.S 40
- 4.7 UART 41
- 4.8 Fast I2C 42
- Configuration 43
- Time-out events 44
- WDT Signal 44
- 4.12 Speedstep Technology 47
- 4.13 C-States 48
- 4.14 Hyper Threading 49
- 4.16 VID-x 51
- 4.18 Display Configuration 53
- DDI Design Consideration 56
- DVI-I Design Topology 56
- 3 independent Display Support 56
- Requirements 57
- Setup a Multi-monitor system 57
- 4.20 Intel® vPro™ technology 58
- 5 System Resources 60
- 5.2 Memory Area 61
- 5.3 I/O Address Map 61
- 5.5 I2C Bus 62
- 5.6 JILI I2C Bus 62
- 5.7 SDVO I2C Bus 62
- 6 Connectors 64
- 7 Pinout List 65
- 7.2 Connector X1A Row A 66
- COMe-bIP6 / Pinout List 67
- 7.3 Connector X1A Row B 68
- 7.4 Connector X1B Row C 70
- 7.5 Connector X1B Row D 72
- 8 BIOS Operation 74
- 8.3 Setup Guide 76
- 8.4 POST Codes 76
- Item Specific Help Window 77
- General Help Window 77
- 8.5 BIOS Setup 78
- Platform Information 79
- 8.5.2 Advanced 80
- PCI Subsystem Settings 81
- ACPI Settings 82
- Trusted Computing 83
- CPU Configuration 84
- CPU Information 85
- Miscellaneous 86
- Onboard I2C Bus Configuration 87
- Watchdog 88
- Smart Battery Configuration 89
- Battery Information 90
- Generic LPC Decode Ranges 91
- Thermal Configuration 92
- Passive Cooling 94
- Intel Fast Flash Standby 95
- PCH-FW Configuration 96
- Firmware Update Configuration 97
- Module COM Port Configuration 99
- Super IO Configuration 100
- Serial Port 1 Configuration 101
- Serial Port 2 Configuration 102
- Parallel Port Configuration 103
- Serial Port 3 Configuration 104
- Serial Port 4 Configuration 105
- H/W Monitor 106
- COMe-bIP6 / BIOS Operation 107
- COM Port allocation 107
- Console Redirection Settings 108
- Intel ICC 109
- Clock Spread Spectrum 110
- CPU PPM Configuration 111
- 8.5.3 Chipset 112
- PCH-IO Configuration 113
- LAN Configuration 114
- SATA Configuration 115
- HDA Configuration 116
- USB Configuration 117
- PCI Express Configuration 118
- SystemAgent Configuration 120
- Graphics Configuration 121
- LCD Control 122
- - DVI-I' 123
- Memory Configuration 125
- Custom Memory Profile Control 126
- GT - Power Management Control 127
- 8.5.4 Boot 128
- Boot Option Priority 129
- 8.5.5 Security 130
- Set HDD Password 131
- 8.5.6 Save & Exit 132
- Corporate Offices 133
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